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SYMPOSIUM C Engineering materials are frequently submitted to mechanical
stresses at high temperatures for long times. Under these conditions, a material
will creep and undergo a time-dependent (viscoelastic) increase in length. During
the material usage or testing, apart from the increase in crystalline defects,
reflected mainly in the dislocation density, there is also coarsening of the
phases in the microstructure and /or formation of new ones, which may be even
undesirable. Voids may also nucleate, grow and coalesce leading to crack nucleation,
propagation and eventually fracture of the material. Depending on temperature
and on the environment, phenomena such as oxidation, carburizing, and hot corrosion,
may contribute significantly to the reduction of the life expectancy of the
component. To make this situation even more critical, the demand on the maximum
usage temperature of the materials has been continuously increasing in the last
decades, aiming at greatest levels of machine efficiency. This symposium looks
into the main aspects related to processing, microstructural characterization,
assessment of properties and understanding of all kind of phenomena that are
critical for the application of materials with engineering significance at high
temperatures.. Scientists, engineers and students are invited to present
and discuss their findings on the following topics:
Symposium Organizers Chair: Co-Chair:
Papers from this Symposium will be published in a Special Issue of Journal of Materials Science To be considered for this special issue, the Brazilian MRS paper number should precede the title of the paper on the manuscript. This number will be removed before publication. The submission window for full manuscripts will be October 1 until November 30, 2006. 1) Go to www.editorialmanager.com/jmsc/ Journal of Materials Science Editors Grant Norton, Mark Aindow and Barry Carter will be present at the meeting to answer any questions. All papers will be fully reviewed in the usual way. Symposia chairs will be sent a copy of each submitted paper
Copyright 2006 |