Symposium Q:

Materials and Processes for Large-Area Electronics

Integration of different materials families and processing technologies is the key to success in large-area electronics. The goal of this symposium is to provide a forum for scientists and engineers to compare different large-area materials and technologies, from silicon to organics.

There is great interest in materials systems that allow the fabrication and integration of thin-film electronic devices over large areas. As a consequence, novel materials that can be processed near ambient temperature have been recently developed to be compatible with large-area flexible substrates for roll-to-roll manufacturing. Low temperature deposition is often achieved by processing materials from a solution. Organic semiconductors - polymers and small molecules, semiconducting and conducting nanoparticle dispersions, and organic/inorganic hybrids are examples of recent additions to the palette of functional materials used to fabricate electronic devices. These unconventional materials have the potential to combine low-cost manufacturing, multiple functionality and ease of integration needed for the next generation of macroelectronic systems. Furthermore, conventional materials, such as hydrogenated amorphous silicon and polysilicon are currently being adapted for low-temperature roll-to-roll processing. As a result, technologists will have at their disposal a wide range of materials to choose from that are most suitable for the desired application. Rather than covering a specific materials systems (e.g polymeric semiconductors) or a specific application (e.g. flexible displays), we plan to cover a broad range of materials and macroelectronic applications.

The purpose of this symposium is to address basic research problems such as charge transport, structure/property relationships, electrical and environmental stability and materials compatibility. Synthesis of novel material types (e.g. polymers, composites, self-assembled arrays of nanoparticles, nanowire-based thin films) as well as materials characterization and device design/characterization will be included. Furthermore, the symposium will cover processing technologies, such as stamping, printing, vapor-jet printing or other innovations that apply to large-area electronics.

Hot topics to be covered by the symposium:

• Solution-processable organic electronic material
• Vacuum-deposited organic materials for low-temperature or roll-to-roll processing
• Nanostructured materials for large-area electronics
• Progress in silicon technology for large-area electronics
• Charge transport: experiments and modeling, structure/property relationships, stability
• Self-assembly techniques to organize nanomaterials into functional systems
• Roll-to-roll processing of electronic devices
• Jet-printing of materials and devices
• Electronic and optoelectronic devices on unconventional substrates (nonplanar, flexible or stretchable surfaces)
• Device integration (sensors, logic, memory)

Confirmed invited speakers:

Paul Burn (U. of Queensland-Australia)

Stéphanie Lacour (Cambridge University-UK)

Sigurd Wagner (Princeton University-USA)

Leni Akcelrud (UFPR-Brasil)

Donal Bradley (Imperial College-UK)

Michael Chabinyc (UC Santa Barbara-USA)

Iain McCulloch (Imperial College-UK)

Roberto Faria (IFSC-Brasil)

Scientific committee members:

Michele Muccini (CNR-ISMN Bologna-Italy)

Paolo Samori (U. Louis Pasteur-France)

Natalie Stingelin (Imperial College-UK)

Howard Katz (Johns Jopkins University-USA)

Carlos Silva (U. Montreal-CA)

Osvaldo Novais de Oliveira Junior (IFSC-USP-Brasil)

Scott Watkins (CSIRO-Australia)

Full papers: Journal of Materials Science (Springer) will publish Special ICAM 2009 issue(s) containing full papers of abstracts presented in this symposium provided such manuscripts are reviewed according to the Journal standards. Authors are invited, not obliged, to submit full length manuscripts.

For instructions, please check Full Papers Publication.

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